The SC-MC-W microcrack detection module developed by Vision Potential can be integrated into the loading sections of texturing lines, etching lines, as well as various types of wafer sorters. By strictly controlling incoming material quality, this module reduces wafer breakage rates and cuts down customers’ manufacturing costs. It is compatible with wafer loading in both perpendicular and parallel orientations (i.e., the direction of wafer saw marks is either perpendicular or parallel to the wafer movement direction). Suitable for monocrystalline, polycrystalline, quasi-monocrystalline wafers and process wafers alike, it lowers breakage rates across multiple production procedures. This module enables fast and accurate detection of wafers with microcrack defects.
| 參數名稱 | 技術指標 |
|---|---|
| 模塊產能 | ＞6000p/H |
| 相機類型 | 高清紅外線掃相機 |
| 適用電池片規格 | 156至210mm(±0.5mm) 160~200μm |
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